TSMC and ARM set new Benchmarks for Performance and Power Efficiency with First Announced FinFET Silicon with 64-bit ARM big.LITTLE Technology

Companies detail results Sept. 30 at TSMC OIP Ecosystem Forum, San Jose, Calif.

Hsinchu, Taiwan and Cambridge, UK, 30 Sept. 2014 –TSMC and ARM® today announced the results from a key FinFET silicon validation of the ARM big.LITTLETM implementation, using ARM Cortex®-A57 and Cortex-A53 processors on TSMC’s advanced 16nm FinFET (16FF) process technology.

Silicon results on 16FF show the “big” Cortex-A57 processor achieving 2.3GHz for sustained mobile peak performance,  as well as the “LITTLE” Cortex-A53 processor consuming only 75mW for most common workloads. The performance improvements are a result of the collaboration between ARM and TSMC to jointly optimize the 64-bit ARMv8-A processor series on FinFET process technologies and build on the successful tape-out of the Cortex-A57 processor on TSMC’s 16FF process last year.

Ongoing collaborative efforts are focused on TSMC’s 16FF+ process technology which will deliver an additional 11% gain in performance for the Cortex-A57 at the same power as the 16FF process, along with a further 35% power reduction for the Cortex-A53 when running low-intensity applications. This further increases the dynamic performance range and power savings for big.LITTLE platforms. 16FF+ is scheduled to be delivered by Q4 2014. Early big.LITTLE implementations of Cortex-A57 and Cortex-A53 processors on 16FF+ are supported by ARM POP™ IP technology.

“This silicon proof point with ARM Cortex-A57 and Cortex-A53 processors demonstrates the additional benefits in performance and power efficiency that 16nm FinFET technology delivers to big.LITTLE implementations,” said Pete Hutton, executive vice president and president, product groups, ARM. “The joint effort of ARM, TSMC, and TSMC’s OIP design ecosystem partners will transform end-user experiences across the next generation of consumer devices and enterprise infrastructure.”

“Our long-term collaboration with ARM continues to push advanced technologies that enable market-leading SoCs for mobile, server, and enterprise infrastructure applications worldwide,” said Dr. Cliff Hou, vice president, R&D, TSMC. “TSMC is proud to be the first foundry to validate the ARM big.LITTLE implementation on FinFET, and this achievement demonstrates in silicon the real-world capabilities of next-generation ARMv8 processors on TSMC’s advanced FinFET technology.”

ARM and TSMC will be presenting detailed results of this collaboration at TSMC’s OIP Ecosystem Forum at the San Jose Convention Center on Sept. 30, 2014; and ARM TechCon at the Santa Clara Convention Center on Oct. 2, 2014.



Phil Hughes                                                                                        +1 512 330 1844
Head of technical PR, ARM                                                               phil.hughes@arm.com

Elizabeth Sun,                                                                                                +886-3-5682085
Director, Corporate Communications, TSMC                                               elizabeth_sun@tsmc.com


About ARM
ARM is at the heart of the world’s most advanced digital products. Our technology enables the creation of new markets and transformation of industries and society. We design scalable, energy efficient-processors and related technologies to deliver the intelligence in applications ranging from sensors to servers, including smartphones, tablets, enterprise infrastructure and the Internet of Things.

Our innovative technology is licensed by ARM Partners who have shipped more than 50 billion System on Chip (SoCs) containing our intellectual property since the company began in 1990. Together with our Connected Community, we are breaking down barriers to innovation for developers, designers and engineers, ensuring a fast, reliable route to market for leading electronics companies. Learn more and join the conversation at http://community.arm.com.

About TSMC

TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry segment’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s owned capacity in 2014 is expected to be about 8 million (12-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFABTM facilities, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China. TSMC is the first foundry to provide 28nm and 20nm production capabilities. TSMC’s corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.


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