2017 Call for Proposals is Now Open

SUBMIT NOW

Proposals are now being accepted for ARM TechCon 2017. Designers, engineers and developers are encouraged to submit their proposals for technical presentations or panels.

All relevant proposals—including topics other than those listed below—will be considered.

  • Technical papers and panel proposals are welcome
  • Technical tracks are listed below
  • Proposal deadline: Friday, May 19, 2017
  • Acceptance notification: first week in July
  • Slides due: Tuesday, September 26, 2017

ARM TechCon 2017
October 24-26, 2017
Santa Clara Convention Center, Santa Clara, CA

ARM TechCon 2017 Technical Tracks:


1. Embedded Software Development

As time-to-market pressures increase, the need to embrace and exploit productive, efficient and smart software development rises. Learn the latest techniques and technologies in debug, multicore software, Linux/Android operating systems, compilation tools, languages, methodologies, optimization, performance tuning and exception handling.


2. Silicon Design

Every year, silicon systems become more complex and this brings fresh challenges. This track will look at how updated IP and tooling can assist with designing complex systems, the growing need for hardware/software co-development to accelerate product design cycles, the hardware implications of functional safety and security requirements, the need for more advanced debug subsystems to successfully bring up complex silicon, and the all-important balance between system architecture and hardware implementation in determining system performance.


3. Automotive, Industrial & Functional Safety

Nowhere has electronics design revolutionized product development more than in the automotive and industrial sectors. Get insight and instruction into some of the most interesting engineering challenges of today, including real-time signal processing, machinery control, embedded vision, functional safety and robotics.


4. Computer Vision, Machine Learning & Graphics

Systems are becoming more intelligent all the time and this requires new insight into system architecture, processing methodologies and machine learning algorithms. Increasingly, these are being coupled with the creation of machines with vision, image processing and virtual/augmented-reality capability. This track will examine new synergies in these critical and growing areas and explore new algorithm and architecture developments.


5. Networking & Servers

The rise of big data has focused attention squarely on enterprise networking and servers, including those deployed in cloud infrastructure. In the Networking & Servers track, sessions will focus on how ARM technology-based systems and subsystems can be optimized-for-purpose, from networking, IFC, and HPC to storage server platforms, heterogeneous systems and open source systems.


6. High-Efficiency Systems

Efficiency was once the sole domain of mobile, battery-constrained systems. This is no longer the case, as energy-efficiency concerns span electronics systems from the cloud out to the edge nodes. The High-Efficiency Systems track will examine power-efficient software and hardware design, sub-volt silicon design, battery life maximization and energy harvesting.


7. Internet of Things

The Internet of Things (IoT) is evolving into a vast system of small, single-purpose, low-power devices that must communicate reliably and efficiently. In the IoT track, learn about sensor fusion, the integration of big and small data, IFC, distributed analytics, communications protocols and the challenges of wearables systems design.


8. Trust & Security

Today’s design ecosystem is rooted in connection at all levels, but these new connections come with significant trust and security considerations. The Trust & Security track details the latest information on provisioning, authentication, encryption, trusted HW/SW, mobile payment, DRM, BYOD, virtualization, and secure boot technologies, among others.


How to Submit a Proposal

Connect with more than 4,000 attendees from the ARM community by answering this call for proposals today! Prepare the following information and submit online by May 19, 2017:

  • Title of submission
  • Conference track preference (REQUIRED), secondary track preference (optional). (Reviewers may move your submission to a more appropriate track based on the content provided in the submission)
  • Session format: 50-minute technical session or panel discussion (If you have a secondary format preference, please note in the comments)
  • Audience level (All. Introductory, Intermediate, or Advanced, REQUIRED) – prerequisites required for advanced
  • Prerequisites (50 words max) –required for advanced audience levels
  • Abstract (100 words max, REQUIRED) – for use on conference web site and mobile app if accepted
  • Extended Abstract (500 words max, REQUIRED) – for use by reviewers to judge your proposal. If proposing a panel, include targeted/confirmed speakers. If including hands-on demonstrations, note that here. Include a detailed explanation of your planned presentation.
  • Key takeaways (50 words max, REQUIRED) – for use on conference web site and mobile app if accepted
  • Comments (optional) – additional notes for reviewers and staff
  • Authors are invited to upload supplemental documents to support their proposal (optional)

Review Criteria

Speaking submissions that grab our attention are:

  • Technical and reveal new ways of thinking about and applying ARM in embedded systems
  • Real-world case studies in which ARM technology is incorporated in a project, innovative application, or a solution to a technical challenge in an end product, including a detailed discussion of the trade-offs and choices made (and why) during the design process
  • A hands-on demonstration illustrating key technical principles that engage the audience in a creative or interactive way
The ARM TechCon 2017 Technical Program Committee of industry experts will review all submissions based on quality, relevance, impact, and originality. Prospective authors are welcome to reference products as long as product references add to the educational value and are presented in an appropriately non-commercial fashion.

  1. Quality – Proposals should be well organized and easily understood. The abstract and summary are judged as indicators of what can be expected of the session.
  2. Relevance – The proposed session or panel should be highly relevant to the interests of the ARM TechCon audience in general and the track topic in particular. Example: real-world case studies.
  3. Impact – Sessions and Panels should contribute to the educational mission and technical nature of ARM TechCon. Submissions reporting on important results, methodologies, or case studies of special significance will be considered favorably.
  4. Originality – Reports on new design methodologies, case studies for innovative designs, or other novel results contribute to the ARM TechCon goal of providing a high-quality educational program for practicing engineers.
  5. Commercial content (less is best) – It is acceptable to use a product in a design case study or as a proof of concept for a design methodology. Product promotion is not permitted in the technical sessions. Proposals with blatant commercial/marketing content will be rejected (The presentation or panel’s focus should be on the design process, technology used, and/or trade-offs, not on selling a product).

Call for Proposals Deadline: Friday, May 19, 2017

SUBMIT NOW

If you have any questions about the CFP process, please feel free to reach out to naomi.price@ubm.com.

For more information about attending ARM TechCon 2017, visit: www.armtechcon.com/